Memory IC test socket solution

  • Memory IC Test Socket
    Applicable products
    DDR, GDDR, LPDDR, eMMC, eUFS, etc.
  • Memory IC Test Socket
    Applicable pitch
    not less than 0.3p but not more than 1.0p
  • Memory IC Test Socket
    Operating temperature
    -55℃ ~ 150℃

  • Features of Elastomer socket for memory IC test

    • It has a block-shaped fin structure that is resistant to impacts.
    • The resistance deviation between pins is small even when repeated contact is used.
    • It is possible to extend thickness and the contact pressure can be lowered.
    • It has low pin resistance and can be used for a long time in repeated contact.

  • Good places to use

    • When the number of socket contacts is high or the long period of use is required
    • When a low contact pressure is needed due to the large number of pins of the semiconductor ICs
    • When it is necessary to avoid damage caused by impact to semiconductor ICs
    • When testing semiconductor ICs with many warpages
    • When the operating temperature range is large