Model H elastomer socket

SNOW Co., Ltd. has three types of silicon rubber test socket solutions
with different structures tailored to the type of semiconductor IC and usage environment.


elastomer test socket

MBP elastomer socket Model 'H' is 130% to 150% thicker than Model 'S'. Compared to 'S', 'H' increases in the maximum compression length by over 30% and reduces the contact pressure by about 30%.

Since the compression length is increased, it is suitable for the semiconductor ICs with a large area of over 30 mm x 30 mm or more or the counterparts with a large number of balls.

Pin resistance is low even with increased thickness. Model 'H' elastomer test socket has an extended service life for repeated contacts based on low contact pressure and extended compression length.

MBP elastomer socket : Contactability, contact pressure, and lifespan become improved by increasing the thickness of the elastomer using MBPs

In case of extending the pin to the 1.5mm thickness

Problems with the existing technology
Increasing the number of particles inside the column (by 1.5 times)
Advantages of new technologies
The number of particles
within the row is available for adjustment.
Increasing the contact area between
individual particles decreases contact resistance.
Reduced resistance
  • Thickness 1mm elastomer test socket
  • Thickness 1.5mm elastomer test socket

As the thickness increases, the stroke also increases.

Contactability, contact pressure, and lifespan become improved by increasing the thickness of the elastomer using MBPs

  • elastomer test socket

    0.8p, resistance @ 0.2mm Existing 130mΩ vs MBE 83mΩ

    Same thickness with changed particle
    → Resistance reduced by 36%

    CE : Conventional Particle Elastomer, MBE : MBP Elastomer

  • elastomer test socket

    Reduced number of particles inside the column decreases column resistance.

As semiconductor IC package technology turns 3D, poor contact quality and decreased lifespan are caused due to the Warpage(50 to 200μm) issues.

As semiconductor IC package technology turns 3D, poor contact quality and decreased lifespan are caused due to the Warpage(50 to 200μm) issues

  • Crying

    Socket thickness
    0.9mm

    elastomer test socket

    Vulnerable to external damage

  • Socket thickness
    1.3mm (MBP technologyapplied)

    elastomer test socket

  • Smiling

    Socket thickness
    0.9mm

    elastomer test socket

    Vulnerable to central damage

  • Socket thickness
    1.3mm (MBP technologyapplied)

    elastomer test socket

Greater thickness results in lower pin pressure and increased stroke, reducing the risk of damage by warpage.